Google’s Tensor chips, used in their Pixel devices, have been evolving rapidly. The Tensor G4 chip, used in the Pixel 9 series, is manufactured by Samsung Foundry on their 4nm process.
Although it represents a minor upgrade from the Pixel 8’s Tensor G3, as shown by benchmarks, it retains the codename ‘Zuma Pro’ (Tensor G4), while the G3 is referred to as ‘Zuma’.
Despite this upgrade, the G4 still uses Samsung’s older FO-PLP packaging rather than the newer FO-WLP, which has been effective in addressing heating issues in the Exynos 2400, unlike its predecessors.
Ultimately, big changes are on the horizon (revealed by Tech & Leaks Zone). Google’s upcoming Tensor G5 chip will be a significant leap forward. For this new chip, Google is switching from Samsung to TSMC for manufacturing.
Google’s Android 16 Redesigns Notifications and Quick Settings Panels: Here’s the first look
The Tensor G5 will be produced using TSMC’s latest 3nm process and will feature the advanced InFO-POP packaging. This shift to TSMC and the new packaging technology should help with performance and heat management.
Looking even further ahead, the Tensor G6, expected to power the Pixel 11 series, will be produced by TSMC on their cutting-edge 2nm process. This chip is likely codenamed ‘Malibu’.
A fun fact in the world of tech is that Apple’s AI models, both on-device and server-based, were actually trained using Google’s TPU clusters, not NVIDIA’s.
Additionally, Google’s own Axion, which is their first custom Arm-cores-based TPU v5p for data centers, is also built on TSMC’s 3nm N3E node. This move highlights the growing collaboration and competition in the tech industry as companies push the boundaries of chip technology.
Discover Amazon Music Unlimited: Activate Your Free Trial Today [USA Only]